Fungi have been in existence for millions of years, evolving to enhance their survival skills over time. Researchers at Binghamton University are delving into the cell structure of fungi to understand how it influences their mechanical properties and how this knowledge can lead to the creation of superior materials.

Published in Advanced Engineering Materials, a study conducted by a team from Binghamton University and the University of California - Merced focused on the microscopic filaments called hyphae that form a network-like structure in mushrooms and other fungi. These hyphal filaments, by twisting and branching within the structure, dictate how fungi respond to mechanical stresses.

Two species, the white button mushroom and the maitake mushroom, were examined for their contrasting characteristics. The white button mushroom has one type of hyphal filaments and grows without a specific orientation, while the maitake mushroom features two types of filaments and grows towards sunlight and moisture.

Researchers used scanning electron microscopy to image the cell structures of the mushrooms and conducted stress load tests to determine their mechanical capabilities.

Mohamed Khalil Elhachimi, a PhD student at the Thomas J. Watson College of Engineering and Applied Science's Department of Mechanical Engineering and the lead author of the study, explained the phases involved in the research process, which include developing a computational framework for mechanical property testing and analysis.

Assistant Professor Mir Jalil Razavi highlighted the role of AI in facilitating the mapping of possibilities for fungi filaments, particularly in the inverse design phase that predicts mechanical behavior based on structure.

The team plans to refine the machine learning model through experimentation, utilizing 3-D printing to create materials with predicted structures for testing. The ultimate goal is to enhance various commercial products, such as construction and aerospace materials, by applying the findings from this research.

Contributors to the study also include Binghamton PhD student Akbar Solhtalab and Assistant Professor Debora Lyn Porter from the University of California - Merced. The research is supported by the Integrated Electronics Engineering Center (IEEC) at Binghamton University.